Blank Cover Image

LOW TEMPERATURE SILICON DIRECT BONDING

Author(s):
Publication title:
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-29
Pub. Year:
1993
Page(from):
240
Page(to):
248
Pages:
9
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770682 [1566770688]
Language:
English
Call no.:
E23400/940556
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Low-Temperature, In Situ, Plasma Activated Wafer Bonding

Roberds, B.E., Farrens, S.N.

Electrochemical Society
7 Conference Proceedings MECHANICAL TESTING OF BONDED SILICON ON INSULATOR WAFERS

Farrens, S. N., Roberds, B., Boettcher, M. C., Ismail, M. S., Bowewr, R. W., Desmond, C. A., Hunt, C. E.

Materials Research Society
2 Conference Proceedings An AFM Study on the Roughness of Silicon Wafers Correlated with Direct Wafer Bonding

Roberds, B., Farrens, S.

Electrochemical Society
8 Conference Proceedings Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies

S.N. Farrens, M. Gabriel

Electrochemical Society
3 Conference Proceedings ANALYSIS OF BOND CHARACTERISTICS IN SIDIRECT-BONDED MATERIALS

S.N. Farrens, B.E. Roberds, J.K. Smith, C.B. Hunt

Electrochemical Society
9 Conference Proceedings Packaging methods and techniques for MOEMS and MEMS (Invited Paper)

Farrens, S.N.

SPIE - The International Society of Optical Engineering
4 Conference Proceedings LOW TEMPERATURE WAFER BONDING OF SURFACES USING A REACTIVE SPUTTERED OXIDE

J.A. Folta, C.B. Hunt, S.N. Farrens

Electrochemical Society
10 Conference Proceedings Beginning-to-end wafer bonding for advanced optical systems (Invited Paper)

Farrens, S.N., Lindner, P., Dwyer, S., Wimplinger, M.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Low Temperature Wafer Bonding

Farrens, S.

Electrochemical Society
11 Conference Proceedings Low Temperture Au-Au Thermal Compression Bonding of Thermally Mismatched Substrates

S. Farrens, S. Sood

Electrochemical Society
6 Conference Proceedings Wafer Bonding of GaAs, InP, and Si Annealed without Hydrogen for Advanced Device Technologies

Roberds, B.E., Choquette, K.D., Geib, K.M., Kravitz, S.H., Twesten, R.D., Farrens, S.N.

Electrochemical Society
12 Conference Proceedings A Low Temperature Direct Bonding Method Using an Electron-Beam Evaporated Silicon-Oxide Interlayer

Park, H. W., Ju, B. K., Lee, Y. H., Park, J. H., Lee, N. Y., Koh, K. H., Shin, D. K., Kang, I. B., Samaan, N., Haskard, …

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12