Blank Cover Image

LOW TEMPERTURE WAFER DIRECT BONDING

Author(s):
Publication title:
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-29
Pub. Year:
1993
Page(from):
96
Page(to):
106
Pages:
11
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770682 [1566770688]
Language:
English
Call no.:
E23400/940556
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings DESIGN CONSIDERATIONS FOR WAFER BONDING OF DISSIMILAR MATERIALS

G. Cha, R. Gafiteanu, Q.-Y. Tong, U. Gosele

Electrochemical Society
7 Conference Proceedings Interface Defects of Bonded Silicon Wafers

Reiche,M., Tong,Q.-Y., Gosele,U., Heydenreich,J.

Trans Tech Publications
2 Conference Proceedings Thick Wafer Bonding

Tong, Q-Y, Gosele, U.

Electrochemical Society
8 Conference Proceedings Phosphorus and Aluminum Gettering of Gold in Silicon: Simulation and Optimization Considerations

Gafiteanu, R., Gosele, U., Tan, T. Y.

MRS - Materials Research Society
3 Conference Proceedings SILICON LAYER TRANSFER BY WAFER BONDING

U. Gösele, Q.-Y. Tong

Electrochemical Society
9 Conference Proceedings DISSOLUTION AND DISINTEGRATION OF UNIFORM SiO2 LAYERS DURING DIRECT SILICON WAFER BONDING

Ahn, K. -Y., Gosele, U., Smith, P.

Materials Research Society
4 Conference Proceedings Wafer bonding involving complex oxides

Alexe, M., Kopperschmidt, P., Gosele, U., Tong, Q-Y., Huang, L-J.

MRS-Materials Research Society
10 Conference Proceedings Progress in silicon-to-silicon direct bonding and its application to synchrotron x-ray optics

Graber,T., Krasnicki,S.F., Fernandez,P.B., Mills,D.M., Tong,Q.-Y., Gosele,U.M.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Point Defects, Diffusion, and Gettering in Silicon

Gosele, U., Conrad, D., Werner, P., Tong, Q-Y., Gafiteanu, R., Tan, T. Y.

MRS - Materials Research Society
11 Conference Proceedings Modified low-temperture direct bonding method for vacuum microelectronics application

Ju,B.-K., Lee,D.-J., Choi,W.-B., Lee,Y.-H., Jang,J., Lee,K.-B., Oh,M.-H.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Process Design of Low Temperature Wafer Bonding

Tong, Q-Y., Goesele, U.

Electrochemical Society
12 Conference Proceedings Low- and High-Temperature Silicon Wafer Direct Bonding for Micromachined Absolute Pressure Sensors

Knechtel, R., Dahlmann, G., Schwarz, U.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12