Evaluation of Material Properties and Quality Monitoring of AI-Cu Films
- Author(s):
- Publication title:
- Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 1993-25
- Pub. Year:
- 1993
- Page(from):
- 149
- Page(to):
- 156
- Pages:
- 8
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566770675 [156677067X]
- Language:
- English
- Call no.:
- E23400/940140
- Type:
- Conference Proceedings
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