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Model-ing the Effect of Polish Pad Deformation on Wafer Surface Stress Distributions During Chemical-Mechanical Polishing

Author(s):
Publication title:
Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-25
Pub. Year:
1993
Page(from):
110
Page(to):
121
Pages:
12
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770675 [156677067X]
Language:
English
Call no.:
E23400/940140
Type:
Conference Proceedings

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