Optimizing Pad Groove Design and Polishing Kinematics for Reduced Shear Force, Low Force Fluctuation and Optimum Removal Rate Attributes of Copper CMP

Optimizing Pad Groove Design and Polishing Kinematics for Reduced Shear Force, Low Force Fluctuation and Optimum Removal Rate Attributes of Copper CMP

Author(s):

Yasa Sampurno

Publication title:

Science and technology of chemical mechanical planarization (CMP) : symposium held April 14-16, 2009, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

1157

Pub. Year:

2010

Page(from):

3

Page(to):

8

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781605111308 [1605111309]

Language:

English

Call no.:

M23500/1157

Type:

Conference Proceedings

Details

TDL ID:	ZA00049469
Series ID:	PA00000011
Conf. info. (Name):	MRS Spring Meeting
Conf. info. (Number):	2009
Conf. info. (Venue):	San Francisco, California, USA
Conf. info. (Date):	2009.04.14-2009.04.16

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