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Ambient Copper-Copper Thermocompression Bonding using Self-Assembled Monolayers

Author(s):
Publication title:
Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
1112
Pub. Year:
2009
Page(from):
91
Page(to):
100
Pages:
10
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781605110844 [1605110841]
Language:
English
Call no.:
M23500/1112
Type:
Conference Proceedings

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