H.-X. Li, J.M. Donohue, W.E. Chrmier, Y.F. Chu
Elsevier
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Feast, S., Bethell, D., Hutchings, G. J., Page, P. C. B., Saberi, S. P., King, F., Rochester, C. H.
Elsevier
|
Di Wang, Li Zhang, Krishna Kamasamudram, William Epling
American Institute of Chemical Engineers
|
Kim, D.J., Sim, H.S., Kim, Y.T., Park, J.-W.
Electrochemical Society
|
Di Wang, Li Zhang, Krishna Kamasamudram, William Epling
American Institute of Chemical Engineers
|
Wang, J.X., Wang, X.L., Sun, D.Z., Li, J.M., Zeng, Y.P., Hu, G.X., Liu, H.X., Lin, L.Y.
Materials Research Society
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Greene, L.H., Feldmann, W.L., Barner, J.B., Farrow, L.A, Miceli, P.F., Ramesh, R., Wilkens, B.J., Bagley, B.G., Giroud, …
Materials Research Society
|
I. Halasz, M. Agarwal, E. Senderov, B. Marcus, W. Cormier
Elsevier
|
Pranit S. Metkar, Michael Harold, Vemuri Balakotaiah
American Institute of Chemical Engineers
|
Norman Wilken, Krishna Kamasamudram, Neal W. Currier, Ramya Vedaiyan, Aleksey Yezerets
American Institute of Chemical Engineers
|
W. Arous, H. Tounsi, S. Djemel, A. Ghorbel, G. Delahay
Elsevier
|
Norman Wilken, Krishna Kamasamudram, Neal W. Currier, Ramya Vedaiyan, Aleksey Yezerets
American Institute of Chemical Engineers
|