Blank Cover Image

Stress Analysis of a Heat-Activated Coupling Joint Subjected to Hydrostatic Internal Pressure

Author(s):
Publication title:
Energy technology conference and exhibition : presented at ETCE/OMAE 2000 Joint Conference : energy for the new millennium, February 14-17, 2000, New Orleans, Louisiana
Title of ser.:
ASME Symposia Volumes
Ser. no.:
OMAE 19(1B)
Pub. Year:
2000
Vol.:
1
Pt.:
B
Paper no.:
ETCE2000/ER-10233
Page(from):
1333
Page(to):
1338
Pages:
6
Pub. info.:
New York, N.Y.: American Society of Mechanical Engineers
ISBN:
9780791819944 [0791819949]
Language:
English
Call no.:
A11702/19
Type:
Conference Proceedings

Similar Items:

Patrick Mensah, Guoqiang Li, Su-Seng Pang, Michael A. Stubblefield

American Society of Mechanical Engineers

Vi Zhao, Su-Seng Pang

American Society of Mechanical Engineers

Samuel I. Ibekwe, Guoqiang Li, Su-Seng Pang

American Society of Mechanical Engineers

Karen E. Crosby, Su-Seng Pang, Reza A. Mirshams

American Society of Mechanical Engineers

Helms, Jack E., Yang, Chihdar, Pang, Su-Seng

Society of Plastics Engineers, Inc. (SPE)

Zhao, Y., Pang, S. -S.

Society of Plastics Engineers, Inc. (SPE)

Zhao, Yi, Pang, Su-Seng

Society of Plastics Engineers, Inc. (SPE)

Jack E. Helms, Guoqiang Li

American Society of Mechanical Engineers

Ming-De Xue, Qing-Hai Du, Dong-Feng Li, Keh-Chih Hwang

American Society of Mechanical Engineers

Toshiyuki Sawa, Satoshi Nagata, Yosuke Akita

American Society of Mechanical Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12