Observation and Numerical Simulation for Wet Chemical Etching Process of Semiconductor

Observation and Numerical Simulation for Wet Chemical Etching Process of Semiconductor

Author(s):

Publication title:

Fora : Proceedings of the 4th ASME/JSME Joint Fluids Engineering Conference : presented at the 4th ASME/JSME Joint Fluids Engineering Conference : July 6-10, 2003, Honolulu, Hawaii

Title of ser.:

ASME Symposia Volumes

Ser. no.:

FLUIDS 2003(1B)

Pub. Year:

2003

Vol.:

1B

Paper no.:

FEDSM2003-45707

Page(from):

795

Page(to):

800

Pages:

6

Pub. info.:

New York, N.Y.: American Society of Mechanical Engineers

ISBN:

9780791836965 [0791836967]

Language:

English

Call no.:

A11646/2003

Type:

Conference Proceedings

Details

TDL ID:	ZA00048637
Series ID:	PA00000270
Conf. info. (Name):	ASME/JSME Joint Fluids Summer Engineering Conference - FEDSM
Conf. info. (Number):	4th
Conf. info. (Venue):	Honolulu, Hawaii
Conf. info. (Date):	2003.07.06-2003.07.10

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