Blank Cover Image

Thermo-Hydraulic Transient Load Analisis for safety Depressurization System Discharge Line Using RELAP5/MOD1 and RELAP5/MOD3.1

Author(s):
Publication title:
Proceedings of the 3rd ASME・JSME Joint Fluids Engineering Conference : presented at the 3rd ASME・JSME Fluids Engineering Conference, July 18-23, 1999, San Francisco, California
Title of ser.:
ASME Symposia Volumes
Ser. no.:
FEDSM 1999
Pub. Year:
2000
Pt.:
3
Paper no.:
FEDSM99-6894
Page(from):
301
Page(to):
308
Pages:
8
Pub. info.:
New York, N.Y.: American Society of Mechanical Engineers
ISBN:
9780791819784 [0791819787]
Language:
English
Call no.:
A11646/1999
Type:
Conference Proceedings

Similar Items:

Kyu Bok Lee, Heedo Lee, Jae Sik Jeung, Hee Jin Ko, Chang Hyo Kim

American Society of Mechanical Engineers

Choi, C. H., Lee, M. W., O. B.-H., Lee, S.-G., Park, S.-G., Lee, E.-H.

SPIE - The International Society of Optical Engineering

Chang Hwan Park, Doo Yong Lee, Ik Jeong, Un Chul Lee, Kune Y. Suh, Goon Cherl Park

American Society of Mechanical Engineers

Peter Matejovic, Milan Bachraty, Lubomir Vranka

American Society of Mechanical Engineers

F. D'Auria, G. M. Galassi, A. Cappariello, J. L. Gago, T. Bajs

American Society of Mechanical Engineers

S. Heo, H. C. No, C. K. Sung, S. H. Ghyym

American Society of Mechanical Engineers

Seok Ho Lee, Han Gon Kim

American Society of Mechanical Engineers

F. Bianchi, P. Meloni, R. Ferri, A. Achilli

American Society of Mechanical Engineers

D. Lübbesmeyer

American Society of Mechanical Engineers

Yoshihisa Shindo, Hiroshi Endo, Tomoko Ishizu, Kazuo Haga

American Society of Mechanical Engineers

J.H. Lim, S.H. Jang, K.M. Yoon, S.Y. Lee, J.H. Joo, H.J. Lee, C.J. Kim

Trans Tech Publications

Richard R. Schultz, Corwin L. Atwood

American Society of Mechanical Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12