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Simulation Framework for Assembly/Disassembly Process Modeling

Author(s):
Publication title:
ASME IEEE International Conference on Mechatronic and Embedded Systems and Applications and the 19th Reliability, Stress Analysis, and Failure Prevention Conference; Volume 4
Title of ser.:
ASME Symposia Volumes
Ser. no.:
DETC 2007(4)
Pub. Year:
2007
Vol.:
4
Paper no.:
DETC2007-34804
Page(from):
1017
Page(to):
1028
Pages:
12
Pub. info.:
New York, N.Y.: American Society of Mechanical Engineers
ISBN:
9780791848050 [0791848051]
Language:
English
Call no.:
A11633/2007
Type:
Conference Proceedings

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