Continuum-Based Design Sensitivity Analysis and Optimization of Springback in Stamping Process

Continuum-Based Design Sensitivity Analysis and Optimization of Springback in Stamping Process

Author(s):

Publication title:

31st Design Automation Conference, Parts A and B; Volume 2

Title of ser.:

ASME Symposia Volumes

Ser. no.:

DETC 2005(2A)

Pub. Year:

2005

Vol.:

2A

Paper no.:

DETC2005-84768

Page(from):

615

Page(to):

626

Pages:

12

Pub. info.:

New York, N.Y.: American Society of Mechanical Engineers

ISBN:

9780791847398 [079184739X]

Language:

English

Call no.:

A11633/2005

Type:

Conference Proceedings

Details

TDL ID:	ZA00048594
Series ID:	PA00000270
Conf. info. (Name):	ASME International Design Engineering Technical Conference ; Computers and Information in Engineering Conference ; Design Automation Conference
Conf. info. (Number):	2005 ; 2005 ; 31st
Conf. info. (Venue):	Long Beach, California USA
Conf. info. (Date):	2005.09.24-2005.09.28

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