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Implant Metrology for Bonded SOI Wafers using a Surface Photo-Voltage Technique

Author(s):
A. F. Bertuch
W. Smith
K. Steeples
R. Standley
A. Stefanescu
R. Johnson
1 more
Publication title:
Silicon-on-insulator technology and devices 13
Title of ser.:
ECS transactions
Ser. no.:
6(4)
Pub. Year:
2007
Page(from):
179
Page(to):
184
Pages:
6
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566775533 [1566775531]
Language:
English
Call no.:
E23400/6-4
Type:
Conference Proceedings

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