Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process
- Author(s):
S. Kim C. Shim J. Hong H. Lee J. Han K. Kim Y. Kim - Publication title:
- Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing
- Title of ser.:
- ECS transactions
- Ser. no.:
- 2(1)
- Pub. Year:
- 2006
- Page(from):
- 237
- Page(to):
- 242
- Pages:
- 6
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566774383 [1566774381]
- Language:
- English
- Call no.:
- E23400/2-1
- Type:
- Conference Proceedings
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