Electrografling, A Unique Wet Technology for Seed and Direct Plating in Copper Metallization
- Author(s):
J. Gonzalez F. Raynal H. Monchoix A. Ben Hamida J. Daviot P. Rabinzohn C. Bureau - Publication title:
- Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
- Title of ser.:
- ECS transactions
- Ser. no.:
- 1(11)
- Pub. Year:
- 2006
- Page(from):
- 155
- Page(to):
- 162
- Pages:
- 8
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566774994 [1566774993]
- Language:
- English
- Call no.:
- E23400/1-11
- Type:
- Conference Proceedings
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