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Investigating the Role of Stress in SOG-filled Shallow-Trench-Isolation Structures of sub-70nm Device

Author(s):
Publication title:
Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
Title of ser.:
ECS transactions
Ser. no.:
1(11)
Pub. Year:
2006
Page(from):
117
Page(to):
124
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781566774994 [1566774993]
Language:
English
Call no.:
E23400/1-11
Type:
Conference Proceedings

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