Blank Cover Image

A NEW FAILURE MECHANISM BY TUNGSTEN BRIDGING IN A PLUG PROCESS DUE TO INCOMPLETE POST-METAL ETCH RESIDUE CLEAN CAUSING CORROSION AND TUNGSTEN RE-DEPOSITION

Author(s):
Publication title:
Cleaning Technology in Semiconductor Device Manufacturing IX
Title of ser.:
ECS transactions
Ser. no.:
1(3)
Pub. Year:
2006
Page(from):
349
Page(to):
356
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781566774291 [1566774292]
Language:
English
Call no.:
E23400/1-3
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Via Failures in a Plug Process Due to Incomplete Via Clean Chemistry Removal

D.M. Florence, S. Burtosky, C. Cioffi, J. Doub, K. Mortensen

Electrochemical Society
7 Conference Proceedings Control and reduction of post-metal etch corrosion effects due to airborne molecular contamination

Morilla,C., Prieto,P., Barbado,F.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings CORROSIVE BEHAVIOR OF TUNGSTEN IN POST-ETCH RESIDUE REMOVER

Zhang, H., Chen, B.H., Ye, J.H., Chooi, S.Y.M., Cha, R., Cha, L.

Electrochemical Society
8 Conference Proceedings MOBILE ION CONTAMINATION AND DEFECT REDUCTION ON A POST-METAL ETCH CLEAN PROCESS

Mautz, K.E.

Electrochemical Society
3 Conference Proceedings Fluorocarbon Post-Plasma Etch Residue Cleaning With Naphthalenide Radical Anions

Timmons, C.L., Hess, D.H.

Electrochemical Society
9 Conference Proceedings The Use of Capillary Electrophoresis for the Evaluation of Post Metal Etch Cleaning Processes

Chan, T., Carpio, R., VanMeurs, R.

Electrochemical Society
4 Conference Proceedings The Effect of Delay Between Dry Etch and Wet Clean Processing Steps on Cleaning of Post-Etch Residues

D. Hellin, I.J. Vos, G. Vereecke, E. Pavel, W. Boullart

Electrochemical Society
10 Conference Proceedings Characterization and Mechanism of Device Failure due to Hollow Via Formation

Hatcher, C., Lappan, R., Prasad, J., Engle, M.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Defect reduction through characterization and equipment modification in tungsten residue caused by deposition process

Lin,H.-T., Lee,S.-C., Chang,H.-W.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Characterization and Mechanism of Device Failure due to Hollow Via Formation

Hatcher, C., Lappan, R., Prasad, J., Engle, M.

Electrochemical Society
6 Conference Proceedings Application of Microwave Downstream Plasma for Cleaning: Post Via-Etch Residue Removal

Deshmukh, S., Burke, R., Chang, J., Cheng, C.C.

Electrochemical Society
12 Conference Proceedings BRIDGING PROCESSES IN METAL-REINFORCED CERAMICS

Shaw, M. C., Marshall, D. B., Evans, A. G.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12