A NOVEL SURFACE CLEANING FOR COPPER INTERCONNECTION USING ATOMIC HYDROGEN

A NOVEL SURFACE CLEANING FOR COPPER INTERCONNECTION USING ATOMIC HYDROGEN

Author(s):

Publication title:

Cleaning Technology in Semiconductor Device Manufacturing IX

Title of ser.:

ECS transactions

Ser. no.:

1(3)

Pub. Year:

2006

Page(from):

327

Page(to):

332

Pages:

6

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566774291 [1566774292]

Language:

English

Call no.:

E23400/1-3

Type:

Conference Proceedings

Details

TDL ID:	ZA00047097
Series ID:	PA00000034
Conf. info. (Name):	International Symposium on Cleaning Technology in Semiconductor Device Manufacturing ; Fall Meeting of the Electrochemical Society
Conf. info. (Number):	9th ; 2005
Conf. info. (Venue):	Los Angeles, California, USA
Conf. info. (Date):	2005.10.00

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