BENEFITS OF SINGLE WAFER POLYMER REMOVAL WITH INORGANIC CHEMICALS ON FEOL AND BEOL STRUCTURES OF DRAMS
- Author(s):
- Publication title:
- Cleaning Technology in Semiconductor Device Manufacturing IX
- Title of ser.:
- ECS transactions
- Ser. no.:
- 1(3)
- Pub. Year:
- 2006
- Page(from):
- 180
- Page(to):
- 186
- Pages:
- 7
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566774291 [1566774292]
- Language:
- English
- Call no.:
- E23400/1-3
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
Electrochemical Society |
9
Conference Proceedings
Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers
SPIE-The International Society for Optical Engineering |
4
Conference Proceedings
Rework/stripping of multilayer materials for FEOL and BEOL integration using single wafer tool techniques
SPIE - The International Society of Optical Engineering |
Electrochemical Society |
SPIE - The International Society of Optical Engineering |
11
Conference Proceedings
Improved performance of hybrid polymer light-emitting device by using inorganic nanocomposite and polymer solutions
Society of Photo-optical Instrumentation Engineers |
6
Conference Proceedings
Corrosion Suppression During Wet Processes in FEOL and BEOL for 45nm Node and Beyond
Electrochemical Society |
SPIE - The International Society of Optical Engineering |