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Contact Model for a Pad Asperity and a Wafer Surface in the Presence of Abrasive Particles for Chemical Mechanical Polishing

Author(s):
Publication title:
Advances and challenges in chemical mechanical planarization : symposium held April 10-12, 2007, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
991
Pub. Year:
2007
Page(from):
343
Page(to):
348
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558999510 [1558999515]
Language:
English
Call no.:
M23500/991
Type:
Conference Proceedings

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