The effect between absorber profile and wafer print process window in ArF 6% Att. PSM mask
- Author(s):
J. Tzeng ( Toppan Chunghwa Electronics Co., Ltd. (Taiwan) ) B. Lee ( Toppan Chunghwa Electronics Co., Ltd. (Taiwan) ) J. Lu ( Toppan Chunghwa Electronics Co., Ltd. (Taiwan) ) M. Kozuma ( Toppan Chunghwa Electronics Co., Ltd. (Taiwan) ) N. Chen ( United Microelectronics Corp. (Taiwan) ) W. K. Lin ( United Microelectronics Corp. (Taiwan) ) A. Chung ( United Microelectronics Corp. (Taiwan) ) Y. C. Houng ( United Microelectronics Corp. (Taiwan) ) C. H. Wei ( United Microelectronics Corp. (Taiwan) ) - Publication title:
- Photomask and next-generation lithography mask technology XIV
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6607
- Pub. Year:
- 2007
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819467454 [0819467456]
- Language:
- English
- Call no.:
- P63600/6607
- Type:
- Conference Proceedings
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