A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond

A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond

Author(s):

M. O. de Beeck ( IMEC (Belgium) )

J. Versluijs ( IMEC (Belgium) )

Z. Tokei ( IMEC (Belgium) )

S. Demuynck ( IMEC (Belgium) )

J. D. Marneffe ( IMEC (Belgium) )

W. Boullart ( IMEC (Belgium) )

S. Vanhaelemeersch ( IMEC (Belgium) )

H. Zhu ( Lam Research Corp. (USA) )

P. Cirigliano ( Lam Research Corp. (USA) )

E. Pavel ( Lam Research Corp. (USA) )

R. Sadjadi ( Lam Research Corp. (USA) )

J. Kim ( Lam Research Corp. (USA) )

7 more

Publication title:

Advances in resist materials and processing technology XXIV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6519

Pub. Year:

2007

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819466389 [0819466387]

Language:

English

Call no.:

P63600/6519

Type:

Conference Proceedings

Details

TDL ID:	ZA00046826
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in Resist Materials and Processing Technology
Conf. info. (Number):	2007 : 24th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2007.02.26-2007.02.28

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