Optimization of lithography process to improve image deformation of contact hole sub-90 nm technology node
- Author(s):
- Publication title:
- Metrology, inspection, and process control for microlithography XXI
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6518
- Pub. Year:
- 2007
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819466372 [0819466379]
- Language:
- English
- Call no.:
- P63600/6518
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Extension of low k1 lithography processes with KrF for 90nm technology node
Society of Photo-optical Instrumentation Engineers |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
SPIE - The International Society of Optical Engineering |
4
Conference Proceedings
Optimization of resist shrink techniques for contact hole and metal trench ArF lithography at the 90-nm technology node
SPIE - The International Society of Optical Engineering |
10
Conference Proceedings
Impact of assistance feature to pattern profile for isolated feature in sub-65 nm node
Society of Photo-optical Instrumentation Engineers |
5
Conference Proceedings
90nm node contact hole patterning through applying model based OPC in KrF lithography
Society of Photo-optical Instrumentation Engineers |
11
Conference Proceedings
90-nm-node CD uniformity improvement using a controlled gradient temperature CAR PEB process
SPIE-The International Society for Optical Engineering |
6
Conference Proceedings
Mask process variation induced OPC accuracy in sub-90 nm technology node [6154-138]
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |