Initial experience establishing an EUV baseline lithography process for manufacturability assessment

Initial experience establishing an EUV baseline lithography process for manufacturability assessment

Author(s):

O. R. Wood II ( Advanced Micro Devices (USA) )

D. Back ( Qimonda North America (USA) )

R. Brainard ( Univ. at Albany (USA) )

G. Denbeaux ( Univ. at Albany (USA) )

D. Goldfarb ( IBM T J Watson Research Ctr. (USA) )

F. Goodwin ( Qimonda North America (USA) )

J. Hartley ( Univ. at Albany (USA) )

K. Kimmel ( IBM Corp. (USA) )

C. Koay ( IBM Corp. (USA) )

B. L. Fontaine ( Advanced Micro Devices (USA) )

J. Mackey ( Micron Technology (USA) )

B. Martinick ( Qimonda North America (USA) )

W. Montgomery ( Univ. at Albany (USA) )

P. Naulleau ( Univ. at Albany (USA) )

U. Okoroanyanwu ( Advanced Micro Devices (USA) )

K. Petrillo ( IBM Corp. (USA) )

B. Pierson ( ASML (USA) )

M. Tittnich ( Univ. at Albany (USA) )

S. Trogisch ( Qimonda Dresden GmbH (Germany) )

T. Wallow ( Advanced Micro Devices (USA) )

Y. Wei ( Qimonda North America (USA) )

16 more

Publication title:

Emerging lithographic technologies XI

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6517

Pub. Year:

2007

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819466365 [0819466360]

Language:

English

Call no.:

P63600/6517

Type:

Conference Proceedings

Details

TDL ID:	ZA00046824
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Emerging Lithographic Technologies
Conf. info. (Number):	2007 : 11th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2007.02.27-2007.03.01

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