High-power slab-coupled optical waveguide laser array packaging for beam combining

High-power slab-coupled optical waveguide laser array packaging for beam combining

Author(s):

L. J. Missaggia ( MIT Lincoln Lab. (USA) )

R. K. Huang ( MIT Lincoln Lab. (USA) )

B. Chann ( MIT Lincoln Lab. (USA) )

C. T. Harris ( MIT Lincoln Lab. (USA) )

J. P. Donnelly ( MIT Lincoln Lab. (USA) )

A. Sanchez ( MIT Lincoln Lab. (USA) )

G. W. Turner ( MIT Lincoln Lab. (USA) )

2 more

Publication title:

Photonics packaging, integration, and interconnects VII : 23-25 January 2007, San Jose, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6478

Pub. Year:

2007

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819465917 [0819465917]

Language:

English

Call no.:

P63600/6478

Type:

Conference Proceedings

Details

TDL ID:	ZA00046786
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Optoelectronic Materials and Devices : Photonics Packaging, Integration, and Interconnects
Conf. info. (Number):	2007 : 7th
Conf. info. (Venue):	San Jose, California, USA
Conf. info. (Date):	2007.01.23-2007.01.25

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