Blank Cover Image

Low cost optical interconnects

Author(s):
E. Palen ( PalenSolutions Consulting (USA) )  
Publication title:
Photonics packaging, integration, and interconnects VII : 23-25 January 2007, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6478
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819465917 [0819465917]
Language:
English
Call no.:
P63600/6478
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Surface mount optical interconnects

E. Palen

Society of Photo-optical Instrumentation Engineers
7 Conference Proceedings Active components for ultra-low-cost optical interconnects (Invited Paper)

Wipiejewski, T., Lui, B., Tong, E., Yau, K., Hung, V., Choi, T., Egnisaban, G., Mangente, T., Cheng, K. S., Ng, A., …

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Optical coupling to monolithic integrated photonic circuits

E. Palen

SPIE - The International Society of Optical Engineering
8 Conference Proceedings Polymer-based optical interconnect technology: a route to low-cost optoelectronic packaging and interconnect

Y.S. Liu, H.S. Cole, J.P. Bristow, Y. Liu

Society of Photo-optical Instrumentation Engineers
3 Conference Proceedings MicroJet Printing for Low Cost Optical Interconnects

Cox,W.Royall, Hayes,D.J., Chen,T., Hoenigman,R.F., MacFarlane,D.L.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Free-space monolithic micro-optical modules: a low-cost route for photonic interconnects to silicon

Thienpont,H., Baukens,V., Ottevaere,H., Volckaerts,B., Tuteleers,P., Vynck,P., Vervaeke,M., Debaes,C., Verschaffelt,G., …

SPIE-The International Society for Optical Engineering
4 Conference Proceedings Low-cost optical interconnect module for parallel optical data links

C. Noddings, T.J. Hirsch, M. Olla, C. Spooner, J.J. Yu

Society of Photo-optical Instrumentation Engineers
10 Conference Proceedings Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects (Invited Paper)

Mikawa, T., Ibaragi, O., Bonkohara, M.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Low-cost planar optical couplers for large-core POF-based interconnects

Li,Y., Fasanella,K., Wang,T.

SPIE - The International Society for Optical Engineering
11 Conference Proceedings Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board [6126-03]

Van Steenberge, G., Hendrickx, N., Geerinck, P., Bosman, E., Van Put, S., Van Erps, J., Thienpont, H., Van Daele, P.

SPIE - The International Society of Optical Engineering
6 Conference Proceedings Development of a technology for fabricating low-cost parallel optical interconnects [6185-07]

Van Steenberge G., Hendrickx N., Geerinck p., Bosman E., Van Put S., Van Daele P.

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Resonant-cavity organic light-emitting diodes for low-cost optical interconnects between CMOS silicon circuits

Jean,F., Mulot,J.-Y., Cambon,P., Geffroy,B., Denis,C., Lorin,A., Venturati,F., Nunzi,J.-M.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12