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Metal contact reliability of RF MEMS switches

Author(s):
Q. Ma ( Intel Corp. (USA) )
Q. Tran ( Intel Corp. (USA) )
T. -K. A. Chou ( Intel Corp. (USA) )
J. Heck ( Intel Corp. (USA) )
H. Bar ( Intel Corp. (USA) )
R. Kant ( Intel Corp. (USA) )
V. Rao ( Intel Corp. (USA) )
2 more
Publication title:
Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6463
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819465764 [0819465763]
Language:
English
Call no.:
P63600/6463
Type:
Conference Proceedings

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