Hybrid approach to MEMS reliability assessment
- Author(s):
- J. L. Zunino III ( U.S. Army RDE Command(USA) )
- D. R. Skelton ( WPI-ME (USA) )
- W. Han ( WPI-ME (USA) )
- R. J. Pryputniewicz ( WPI-ME (USA) )
- Publication title:
- Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6463
- Pub. Year:
- 2007
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819465764 [0819465763]
- Language:
- English
- Call no.:
- P63600/6463
- Type:
- Conference Proceedings
Similar Items:
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
2
Conference Proceedings
U.S. Army Corrosion Office's storage and quality requirements for military MEMS program
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
3
Conference Proceedings
Reliability testing and analysis of safing and arming devices for army fuzes
Society of Photo-optical Instrumentation Engineers |
SPIE - The International Society of Optical Engineering |
4
Conference Proceedings
Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program
SPIE - The International Society of Optical Engineering |
10
Conference Proceedings
Investigations of laser percussion drilling of small holes on thin sheet metals
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
11
Conference Proceedings
Studies of the blue to red phase transition in polydiacetylene nanocomposites and blends
Materials Research Society |
6
Conference Proceedings
Guidelines for reliability testing of microelectromechanical systems in military applications [6111-24]
SPIE - The International Society of Optical Engineering |
12
Conference Proceedings
Computational and Experimental Approach to study of a Nanoindentation Process for MEMS
IMAPS |