Low Temperature Direct Metal Bonding by Self Assembled Monolayers

Low Temperature Direct Metal Bonding by Self Assembled Monolayers

Author(s):

Xiaofang Ang

Publication title:

Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics : symposium held April 10-12, 2007, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

990

Pub. Year:

2007

Page(from):

287

Page(to):

294

Pages:

8

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558999503 [1558999507]

Language:

English

Call no.:

M23500/990

Type:

Conference Proceedings

Details

TDL ID:	ZA00046630
Series ID:	PA00000011
Conf. info. (Name):	MRS Spring Meeting : Symposium B
Conf. info. (Number):	2007
Conf. info. (Venue):	San Francisco, California, USA
Conf. info. (Date):	2007.04.10-2007.04.12

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