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A Study of Tungsten-Titanium Barriers in Silver Metallization

Author(s):
Publication title:
Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics : symposium held April 10-12, 2007, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
990
Pub. Year:
2007
Page(from):
153
Page(to):
158
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558999503 [1558999507]
Language:
English
Call no.:
M23500/990
Type:
Conference Proceedings

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