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Thermo-Mechanical Reliability of 3-D-Integrated Microstructures in Stacked Silicon

Author(s):
Bernhard Wunderle
R. Mrossko
O. Wittler
E. Kaulfersch
P. Ramm
B. Michel
H. Reichl
2 more
Publication title:
Enabling technologies for 3-D integration : symposium held November 27-29, 2006, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
970
Pub. Year:
2007
Page(from):
67
Page(to):
78
Pages:
12
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558999275 [1558999272]
Language:
English
Call no.:
M23500/970
Type:
Conference Proceedings

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