Factors Affecting the Mechanical Properties of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joints

Factors Affecting the Mechanical Properties of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joints

Author(s):

Publication title:

Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

968

Pub. Year:

2007

Page(from):

117

Page(to):

124

Pages:

8

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558999251 [1558999256]

Language:

English

Call no.:

M23500/968

Type:

Conference Proceedings

Details

TDL ID:	ZA00046623
Series ID:	PA00000011
Conf. info. (Name):	MRS Fall Meeting : Symposium V
Conf. info. (Number):	2006
Conf. info. (Venue):	Boston, Massachusetts, USA
Conf. info. (Date):	2006.11.27-2006.11.30

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