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Compression Creep Behavior of the 95.5Sn-(4.3, 3.9, 3.8)Ag-(0.2, 0.6, 0.7)Cu Solders

Author(s):
Publication title:
Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
968
Pub. Year:
2007
Page(from):
103
Page(to):
116
Pages:
14
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558999251 [1558999256]
Language:
English
Call no.:
M23500/968
Type:
Conference Proceedings

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