Blank Cover Image

Limit for Controlling Stabilization of Cu Powder Prepared from Cu2o-H2O System

Author(s):
H.T. Hai
D.J. Kim
Y.D. Kim
C.O. Kim
H.S. Chung
J.G. Ahn
1 more
Publication title:
Recrystallization and grain growth III : proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX & GG III, held in Jeju Island, Korea, June 10-15 2007
Title of ser.:
Materials science forum
Ser. no.:
558-559(1)
Pub. Year:
2007
Vol.:
558-559
Page(from):
741
Page(to):
746
Pages:
6
Pub. info.:
Stafa-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494439 [087849443X]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

J.G. Ahn, D.J. Kim, Y.N. Jang, C.O. Kim, H.S. Chung, H.T. Hai

Trans Tech Publications

Kim, C.G., Lee, H.S., Ahn, Y.C., Chung, U.I., Lee, J.K., Lee, J.G.

Materials Research Society

Ahn, J.G., Kim, D.J., Hoang, H., Lee, J., Chung, H.S.

Trans Tech Publications

Raistrick, I.D., Cooke, D.W., Beery, J.G., Garzon, F.H., Javadi, H., Maley, M.P., Rollett, A.D., Roy, T., Sinha, D.N., …

Materials Research Society

Ahn, J. G., Kim, D. J., Hai, H. T., Lee, J., Chung, H. S., Kim, C. O.

Trans Tech Publications

H.S. Chung, M.T. Kim, J.H. Choi, J.H. Ahn

Trans Tech Publications

J.G. Ahn, D.J. Kim, J.R. Lee, H.S. Jung, B.G. Kim

Trans Tech Publications

Kim, D.G., Kim, G.S., Kim, J.C., Oh, S.T., Kim, Y.D.

Trans Tech Publications

Ahn, J.G., Kim, D.J., Shin, C.H., Lee, M.S.

Trans Tech Publications

H.S. Chung, R.M. Heo, M.T. Kim, J.H. Ahn

Trans Tech Publications

Lee, J., Lee, I., Chung, H., Ahn, J.G., Kim, D.J., Kim, B.

Trans Tech Publications

Oh, S.T., Choa, Y.H., Kim, Y.D.

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12