High Throughput SiC Wafer Polishing with Good Surface Morphology
- Author(s):
T. Kato K. Wada E. Hozomi H. Taniguchi T. Miura S.I. Nishizawa K. Arai - Publication title:
- Silicon carbide and related materials 2006 : ECSCRM 2006, Proceedings of the 6th European Conference on Silicon Carbide and Related Materials, Newcastle upon Tyne, UK, September 2006
- Title of ser.:
- Materials science forum
- Ser. no.:
- 556-557
- Pub. Year:
- 2007
- Page(from):
- 753
- Page(to):
- 756
- Pages:
- 4
- Pub. info.:
- Stafa-Zuerich: Trans Tech Publications
- ISSN:
- 02555476
- ISBN:
- 9780878494422 [0878494421]
- Language:
- English
- Call no.:
- M23650
- Type:
- Conference Proceedings
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