Transverse Compressive Stress Effects on the Critical Current of Bi-2223 Tapes

Transverse Compressive Stress Effects on the Critical Current of Bi-2223 Tapes

Author(s):

C.S. Li

Publication title:

Superconducting and functional materials : Progress in light metals, aerospace materials and superconductors . 2006 BIMW : 2006 Beijing International Materials Week, June 25-30, 2006, Beijing, China

Title of ser.:

Materials science forum

Ser. no.:

546-549(4)

Pub. Year:

2007

Vol.:

546-549

Page(from):

1923

Page(to):

1926

Pages:

4

Pub. info.:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494323 [0878494324]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00046604
Series ID:	PA00000012
Conf. info. (Name):	Beijing International Materials Week
Conf. info. (Number):	2006
Conf. info. (Venue):	Beijing, China
Conf. info. (Date):	2006.06.25-2006.06.30

Similar Items:

1 Conference Proceedings Study on the Precursory Powder for Bi-2223 Tape H.L. Zheng, X.Y. Xu, X.M. Xiong, G.Q. Liu, Q.B. Hao, C.S. Li, P.X. Zhang, Y.F. Lu Trans Tech Publications	7 Conference Proceedings Influence of Preparation Process on Microstructure, Critical Current Density and Tc of MgB2/Fe/Cu Wires Y.F. Wu, G. Yan, J.S. Li, Y. Feng, S.K. Chen, H.P. Tang, H.L. Xu, C.S. Li, P.X. Zhang, Y.F. Lu Trans Tech Publications
2 Conference Proceedings Influence of Repeated Tensile Stress on Determining the Critical Tensile Stress/Strain of Copper Reinforced Bi-2223/Ag Tapes L.W. Jing, G.M. Zhang, J.C. Li, X. Wu, Q. Liu Trans Tech Publications	8 Conference Proceedings Effects of Spatial Distribution of Defects on Bending Deformation and Critical Current in Bi2223/Ag Superconducting Composite Tapes M. Hojo, M. Nakamura, M. Tanaka, T. Adachi, M. Sugano, S. Ochiai, K. Osamura Trans Tech Publications
3 Conference Proceedings Development of Ag-Sheathed Bi2223 Tapes with Interfilamentary Resistive Barriers for Reducing AC Losses A. Oota, R. Inada, Y. Iwata, Y. Nakamura, P.X. Zhang Trans Tech Publications	9 Conference Proceedings Influences of Preparation Conditions on Melting and Reformation Behaviors of (Bi,Pb)-2223 Core in the Ag-Sheathed Tape J.Y. Li, H.L. Zheng, J.G. Li, C.S. Li, Y.F. Lu, L. Zhou Trans Tech Publications
4 Conference Proceedings Improvements of Superconducting Properties on Bi-2212 Bulks by Element Doping S.N. Zhang, C.S. Li, Q.B. Hao, T.N. Lu, P.X. Zhang Trans Tech Publications	10 Conference Proceedings Study on Minimum Propagation Current of Bi-2223/Ag Superconducting Multifilament Tape Z.M. Bai, C.L. Wu, H.L. Yang, J.X. Wang Trans Tech Publications
5 Conference Proceedings Effect of Heat Treatment on Superconducting Properties of Pure and Ti, Zr-Doped MgB2 Superconducting Wires Fabricated by In Situ PIT Method G. Yan, Y.F. Lu, Y. Feng, P.X. Zhang, L. Zhou, A. Sulpice, E. Mossang Trans Tech Publications	11 Conference Proceedings Effect of Various C Sources Co-Doping on Transport Critical Current Density and Grains-Connectivity of MgB₂/Fe Tapes X.F. Pan, G. Yan, X.H. Liu, Y. Feng, P.X. Zhang Trans Tech Publications
6 Conference Proceedings Bending Strain Effects on the Critical Current of Bi-2223 Superconducting Tapes by Pure Bending Method Z.Y. Lu, X.Q. Huang, Y.F. He, J. Sun, J.X. Wang Trans Tech Publications	12 Conference Proceedings Bending Damage Evolution and Its Influence on Critical Current and N-Value of Bi2223/Ag Superconducting Composite Tape Doko, D., Miyazaki, N., Ochiai, S., Okuda, H., Oh, S. S., Tanaka, M., Hojo, M., Osamura, K. Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12