Numerical Simulation on Conform Process of Aluminum Alloy Rectangular Hollow Conductor

Numerical Simulation on Conform Process of Aluminum Alloy Rectangular Hollow Conductor

Author(s):

Publication title:

Aluminium materials : Progress in light metals, aerospace materials and superconductors . 2006 BIMW : 2006 Beijing International Materials Week, June 25-30, 2006, Beijing, China

Title of ser.:

Materials science forum

Ser. no.:

546-549(2)

Pub. Year:

2007

Vol.:

546-549

Page(from):

735

Page(to):

740

Pages:

6

Pub. info.:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494323 [0878494324]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00046602
Series ID:	PA00000012
Conf. info. (Name):	Beijing International Materials Week
Conf. info. (Number):	2006
Conf. info. (Venue):	Beijing, China
Conf. info. (Date):	2006.06.25-2006.06.30

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