Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

Author(s):

Publication title:

THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada

Title of ser.:

Materials science forum

Ser. no.:

539-543(3)

Pub. Year:

2007

Vol.:

539-543

Page(from):

2798

Page(to):

2803

Pages:

6

Pub. info.:

Stafa-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494286 [0878494286]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00046597
Series ID:	PA00000012
Conf. info. (Name):	THERMEC ; International conference on processing and manufacturing of advanced materialsMATERIALS
Conf. info. (Number):	2006 ; 5th
Conf. info. (Venue):	Vancouver, Canada
Conf. info. (Date):	2006.07.04-2006.07.08

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