Blank Cover Image

Phase-Field Modeling of the Microstructure Evolutions in Fe-Cu Base Alloys

Author(s):
Publication title:
THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada
Title of ser.:
Materials science forum
Ser. no.:
539-543(3)
Pub. Year:
2007
Vol.:
539-543
Page(from):
2383
Page(to):
2388
Pages:
6
Pub. info.:
Stafa-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494286 [0878494286]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

T. Koyama, H. Onodera

Trans Tech Publications

T. Kushima, K. Tsuchiya, Y. Sho, T. Yamada, Y. Todaka, M. Umemoto

Trans Tech Publications

T. Koyama, H. Onodera

Trans Tech Publications

Miyazaki, Toru, Koyama, Toshiyuki, Kozakai, Takao

MRS - Materials Research Society

Y. Suwa, Y. Saito, H. Onodera

Trans Tech Publications

Hao, X. J., Ohtsuka, H.

Trans Tech Publications

Kozakai, T., Shikama, T., Koyama, T., Doi, M.

Trans Tech Publications

H. Onodera, T. Abe, K. Hashimoto

Trans Tech Publications

H. Li, C.X. Jia, P.C. Zhang, J.C. Jie, T.J. Li

Trans Tech Publications

S.Y. Yang, C.P. Wang, Y. Su, X.J. Liu

Trans Tech Publications

S.L. Yang, J. Shen, X.W. Li, X.D. Yan, B.P. Mao

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12