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Microsegregation Effect of Copper in Solidification of A356 Alloy

Author(s):
J.I. Cho
X. Yan
C.S. Kang
I.H. Oh
J.S. Lee
H.T. Son
J.C. Bae
2 more
Publication title:
THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canad
Title of ser.:
Materials science forum
Ser. no.:
539-543(1)
Pub. Year:
2007
Vol.:
539-543
Page(from):
452
Page(to):
456
Pages:
5
Pub. info.:
Stafa-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494286 [0878494286]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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