Full-chip lithography manufacturability check for yield improvement [6156-33]
- Author(s):
Huang, Y. ( United Microelectronics Corp. (Taiwan) ) Tseng, E. ( United Microelectronics Corp. (Taiwan) ) Lin, B. S.-M ( United Microelectronics Corp. (Taiwan) ) Yu, C. C. ( United Microelectronics Corp. (Taiwan) ) Wang, C.-W. ( Brion Technologies (USA) ) Liu, H.-Y. ( Brion Technologies (USA) ) - Publication title:
- Design and process integration for microelectronic manufacturing IV : 23-24 February, 2006, San Jose, California, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6156
- Pub. Year:
- 2006
- Page(from):
- 61560W
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819461995 [0819461997]
- Language:
- English
- Call no.:
- P63600/6156
- Type:
- Conference Proceedings
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