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Simulation based OPC for contact pattern using 193 nm lithography [5853-63]

Author(s):
Keck, M.
Bodendorf, C.
Thiele, J. ( Infineon Technologies AG (Germany) )
Gomez, A. L.
Tseng, Y.-C.
Huang, T.-Y. ( Infineon Technologies SC300 GmbH & Co. OHG (Germany) )
1 more
Publication title:
Photomask and Next-Generation Lithography Mask Technology XII
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5853
Pub. Year:
2005
Pt.:
2
Page(from):
776
Page(to):
784
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819458537 [0819458538]
Language:
English
Call no.:
P63600/5853
Type:
Conference Proceedings

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