Patterning of Ta/Si02 high transmission EAPSM material for 193nm technology [5853-26]

Patterning of Ta/Si02 high transmission EAPSM material for 193nm technology [5853-26]

Author(s):

Koepernik, C. ( IMS Chips (Germany) )

Becker, H. W. ( Schott Lithotec (Germany) )

Butschke, J. ( MS Chips (Germany) )

Buttgereit, U. ( Schott Lithotec (Germany) )

Irmscher, M.

Nedelmann, L. ( IMS Chips (Germany) )

Schmidt, F. ( Schott Lithotec (Germany) )

Teuber, S. ( Advanced Mask Technology Ctr. (Germany) )

3 more

Publication title:

Photomask and Next-Generation Lithography Mask Technology XII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5853

Pub. Year:

2005

Pt.:

1

Page(from):

463

Page(to):

473

Pages:

11

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819458537 [0819458538]

Language:

English

Call no.:

P63600/5853

Type:

Conference Proceedings

Details

TDL ID:	ZA00016424
Series ID:	PA00000029
Conf. info. (Name):	Photomask and next-generation lithography mask technology
Conf. info. (Number):	2005 : 12th
Conf. info. (Venue):	Yokohama, Japan
Conf. info. (Date):	2005.04.13-2005.04.15

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