Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results (Invited Paper) [6185-27]

Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results (Invited Paper) [6185-27]

Author(s):

Vervaeke M. ( Vrije Univ. Brussel (Belgium) )

Lahti M.

Karpinnen M. ( VTT Technical Research Ctr. of Finland (Finland) )

Debaes C.

Volckaerts B. ( Vrije Univ. Brussel (Belgium) )

Karioja P. ( VTT Technical Research Ctr. of Finland (Finland) )

Thienpont H. ( Vrije Univ. Brussel (Belgium) )

2 more

Publication title:

Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6185

Pub. Year:

2006

Page(from):

61850P

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819462411 [0819462411]

Language:

English

Call no.:

P63600/6185

Type:

Conference Proceedings

Details

TDL ID:	ZA00016410
Series ID:	PA00000029
Conf. info. (Name):	Photonics Europe : Micro-Optics, VCSELs, and Photonic Interconnects
Conf. info. (Number):	2006 : 2nd
Conf. info. (Venue):	Strasbourg, France
Conf. info. (Date):	2006.04.03-2006.04.05

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