Down-hole seismic survey system with fiber-optic accelerometer sensor array for 3-dimensions vertical seismic profile (3D-VSP) [6293-33]

Down-hole seismic survey system with fiber-optic accelerometer sensor array for 3-dimensions vertical seismic profile (3D-VSP) [6293-33]

Author(s):

Zou Q.

Liao Y. ( Tsinghua Univ. (China) )

1 more

Publication title:

Interferometry XIII: Applications

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6293

Pub. Year:

2006

Page(from):

62930W

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819463722 [0819463728]

Language:

English

Call no.:

P63600/6293

Type:

Conference Proceedings

Details

TDL ID:	ZA00016299
Series ID:	PA00000029
Conf. info. (Name):	Optics & Photonics : Interferometry
Conf. info. (Number):	2006 : 13th
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	2006.08.16-2006.08.17

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