A methodology to weight OPC modeling data plans [6283-72]
- Author(s):
Hung, -Y. C. Wang, -H. C. Liu, Q. ( Semiconductor Manufacturing International Corp. (China) ) Ma, C. ( KLA-Tencor Inc. (USA) ) Wu, K. ( Anchor Semiconductor Inc. (USA) ) Zhang, G. ( Anchor Semiconductor Inc. (China) ) - Publication title:
- Photomask and Next-Generation Lithography Mask Technology XIII
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6283
- Pub. Year:
- 2006
- Pt.:
- 2
- Page(from):
- 628331
- Page(to):
- 628331
- Pages:
- 1
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819463586 [0819463582]
- Language:
- English
- Call no.:
- P63600/6283
- Type:
- Conference Proceedings
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