Process window OPC for reduced process variability and enhanced yield [6154-139]

Process window OPC for reduced process variability and enhanced yield [6154-139]

Author(s):

Krasnoperova, A. ( IBM Systems and Technology Group (USA) )

Culp, J. A. ( IBM Systems and Technology Group (USA) )

Graur, I. ( IBM Systems and Technology Group (USA) )

Mansfield, S. ( IBM Systems and Technology Group (USA) )

Al-Imam, M. ( Mentor Graphics Corp. (Egypt) )

Maaty, H. ( Mentor Graphics Corp. (Egypt) )

1 more

Publication title:

Optical Microlithography XIX

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6154

Pub. Year:

2006

Pt.:

3

Page(from):

61543L

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819461971 [0819461970]

Language:

English

Call no.:

P63600/6154

Type:

Conference Proceedings

Details

TDL ID:	ZA00016186
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Optical Microlithography
Conf. info. (Number):	2006 : 19th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2006.02.21-2006.02.24

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