Blank Cover Image

Mask topography effect on OPC at hyper NA lithography [6154-64]

Author(s):
Lee S ( Samsung Electronics Co. Ltd. (South Korea) )
Kim I. S ( Samsung Electronics Co. Ltd. (South Korea) )
Chun Y. J ( Samsung Electronics Co. Ltd. (South Korea) )
Kim S.-W ( Samsung Electronics Co. Ltd. (South Korea) )
Lee S.J ( Samsung Electronics Co. Ltd. (South Korea) )
Wood, S.-G ( Samsung Electronics Co. Ltd. (South Korea) )
Cho H. K ( Samsung Electronics Co. Ltd. (South Korea) )
Moon J.-T ( Samsung Electronics Co. Ltd. (South Korea) )
3 more
Publication title:
Optical Microlithography XIX
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6154
Pub. Year:
2006
Pt.:
2
Page(from):
61541R
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461971 [0819461970]
Language:
English
Call no.:
P63600/6154
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Virtual OPC at hyper NA lithography

S. Lee, S. Kim, Y. Chun, S. Suh, Y. Jang, S. Choi, W. Han

SPIE - The International Society of Optical Engineering
7 Conference Proceedings Simulation and experiments for inspection properties of EUV mask defects [6283-85]

Park, J., Kim, -S. S., Lee, S., Woo, -G. S., Cho, -K. H., Moon, -T. J.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Simulation of mask induced polarization effect on imaging in immersion lithography [6154-105]

Kwak, E. A., Jung, M. R., Kim, D.-G., Lee, J.-E., Oh, H.-K., Lee, S.

SPIE - The International Society of Optical Engineering
8 Conference Proceedings The effect of localized mask density variations on image quality in EUV lithography

J. Park, H. Seo, S. Kim, H. Cho, J. Moon

SPIE - The International Society of Optical Engineering
3 Conference Proceedings Mask process variation induced OPC accuracy in sub-90 nm technology node [6154-138]

Park, S.J., Shim, Y.A., Kang, J.H., Choi,J Y, Yoon K H, Lee Y S, Kim K

SPIE - The International Society of Optical Engineering
9 Conference Proceedings First microprocessors with immersion lithography

Lee, D.-Y., Kim, I.-S., Jung, S.-G., Jung, M.-H., Park, J.-O., Oh, S.-H., Woo, S.-G., Cho, H.-K., Moon, J.-T.

SPIE - The International Society of Optical Engineering
4 Conference Proceedings OPC to account for thick mask effect using simplified boundary layer model [6349-133]

Kim, S., Kim, Y.-C., Suh, S., Lee, S., Cho, H., Moon, J., Cobb, J.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings Adaptability and validity of thin organic bottom anti-reflective coating (BARC) to sub-90-nm patterning in ArF lithography

Kim, S.-H., Lee, S.-H., Yeo, G.-S., Lee, J.H., Cho, H.-K., Han, W.-S., Moon, J.-T.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Attainable road to the lower-k1 extension using high-transmittance attenuated phase-shifting mask in the KrF lithography world

Kim, I.-S., Jung, S.-G., Kim, H.-D., Yeo, G.-S., Shin, I.-K., Lee, J.-H., Cho, H.-K., Moon, J.-T.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings One step forward to maturity of AF (assistant feature)-OPC in 100-nm level DRAM application

Kang,H.-J., Kim,B.-S., Park,J.-S., Kim,I.-S., Yeo,G.-S., Lee,J.-H., Cho,H.-K., Moon,J.-T.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Development of multi-function hard mask to simplify process step [6153-108]

Lee, K., Kim, S., Lee, G., Lee, S., Cho J, Kim W, Bok C, Kim H, Moon S, Kim J

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Effect of line-edge roughness (LER) and line-width roughness (LWR) on sub-100-nm device performance

Lee, J.-Y., Shin, J., Kim, H.-W., Woo, S.-G., Cho, H.-K., Han, W.-S., Moon, J.-T.

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12