Newly developed RELACS materials and processes for the 65 nm node and beyond [6153-92]

Newly developed RELACS materials and processes for the 65 nm node and beyond [6153-92]

Author(s):

Terai, M ( Mitsubishi Electric Corp. (Japan) )

Kumada, T. ( Mitsubishi Electric Corp. (Japan) )

Ishibashi, T. ( Renesas Technology Corp. (Japan) )

Hanawa, T. ( Renesas Technology Corp. (Japan) )

Satake, N. ( AZ Electronic Materials K. K. (Japan) )

Takano, Y. ( AZ Electronic Materials K. K. (Japan) )

1 more

Publication title:

Advances in Resist Technology and Processing XXIII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6153

Pub. Year:

2006

Pt.:

2

Page(from):

61532I

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819461964 [0819461962]

Language:

English

Call no.:

P63600/6153

Type:

Conference Proceedings

Details

TDL ID:	ZA00016185
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in Resist Technology and Processing
Conf. info. (Number):	2006 : 23th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2006.02.20-2006.02.22

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