Performanc of dry resist under wet conditions [6153-07]

Performanc of dry resist under wet conditions [6153-07]

Author(s):

Padmanaban, M ( AZ Electronic Materials (USA) )

Romano, A ( AZ Electronic Materials (USA) )

Lin, G. ( AZ Electronic Materials (USA) )

Chiu, S ( AZ Electronic Materials (USA) )

Timko, A ( AZ Electronic Materials (USA) )

Houlihan, F ( AZ Electronic Materials (USA) )

Rahman, D ( AZ Electronic Materials (USA) )

Chakrapani, S ( AZ Electronic Materials (USA) )

Kudo, T

Dammel, R. R. ( AZ Electronic Materials (USA) )

Turnquest, K ( International SEMATECH (USA) )

Rich, G ( International SEMATECH (USA) )

Schuetter, S D ( Univ of Wisconsin, Madison (USA) )

Shedd T A ( Univ of Wisconsin, Madison (USA) )

Nellis G F ( Univ of Wisconsin, Madison (USA) )

10 more

Publication title:

Advances in Resist Technology and Processing XXIII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6153

Pub. Year:

2006

Pt.:

1

Page(from):

615307

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819461964 [0819461962]

Language:

English

Call no.:

P63600/6153

Type:

Conference Proceedings

Details

TDL ID:	ZA00016185
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in Resist Technology and Processing
Conf. info. (Number):	2006 : 23th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2006.02.20-2006.02.22

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